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TSMC Revolutionizes On-Package Communication
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TSMC unveils a high-speed silicon photonics interconnect solution with 12.8 Tbps bandwidth to enhance on-package communication for AI applications and datacenters.
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How does this advancement position TSMC in the competitive semiconductor market?
How might TSMC's innovation impact the performance of AI applications?
What challenges could arise in implementing such high-speed communication solutions?
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