Jiangsu Silicon Integrity Semiconductor Technology Co., LTD (JSSI) focuses on mobile products, offering turnkey high-tech middle-end and back-end packaging and test services for customers in the semiconductor industry.

Jiangsu Silicon Integrity Semiconductor Technology Co., LTD

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Xinde Semiconductor offers services for semiconductor packaging and testing. It offers clients turnkey high-tech mid- and back-end packaging and testing services, with a focus on mobile products.

KQ Capital

Panorama Capital

Venture Round - Xinde Semiconductor

Junhai Games

Series A - Xinde Semiconductor

Huatai New Industry Fund

Angel Round - Xinde Semiconductor

Nanjing

Jiangsu

China

Asia

Xinde Semiconductor

A semiconductor packaging process involving the creation of solderable or conductive bumps on the chip.

Wafer-level chip-scale packaging, a method that packages the chip at the wafer level.

A packaging technology where the semiconductor chip is mounted flipped onto the substrate or board.

Quad Flat No-leads package, a compact, surface-mounted device packaging option.

Ball Grid Array, a type of surface-mount packaging used for integrated circuits.

System in Package, integrates multiple integrated circuits into a single package.

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North America

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Jiangsu Silicon Integrity Semiconductor Technology Co., LTD