Founded in 2011, Kandou is the innovative leader in high-speed, energy efficient, chip-to-chip link solutions critical to the evolution of the electronics industry. Kandou enables a better-connected world by offering disruptive technology through licensing and standard products that empower the devices we use every day to become smaller, more energy efficient and more cost effective.  Kandou has a strong IP portfolio that includes Chord™ signaling, which has been adopted into industry specifications by JEDEC and the OIF. These innovations and implementations deliver a fundamental advance in interconnect technology that lowers the power consumed and improves the performance of chip links, unlocking new capabilities for customer devices and systems.  Kandou is a fabless semiconductor company headquartered in Lausanne, Switzerland with offices in Europe, North America and Asia.

Innosuisse

Walden International

Raging Capital

Bessemer Venture Partners

Climb Ventures

Columbia Lake Partners

Kreos Capital

Digital Transformation Fund

Fayerweather Fund

Flexstone Partners

Forestay Capital

Swisscom Ventures

DC Investment Partners

Kandou

Xperi Corporation is a leading innovator in semiconductor and digital technology, providing high-speed data interconnect solutions.

Xperi

Quantum Leap Packaging specializes in high-speed data interconnect solutions for advanced packaging technologies.

Quantum Leap Packaging

Ayar Labs is a leading innovator in the development of high-speed optical interconnect solutions for data centers and high-performance computing.

Ayar Labs

Avicena is a technology company specializing in high-speed interconnect solutions for data centers and enterprise networking.

Avicena

Techpoint is a provider of high-speed data interconnect solutions for consumer electronics and enterprise applications.

Techpoint

Nations Technologies specializes in high-speed data interconnect solutions for enterprise networking and telecommunications.

Nations Technologies

Raydium is a provider of high-speed data interconnect solutions for consumer electronics and automotive applications.

Raydium

MPI specializes in high-speed data interconnect solutions for data centers, enterprise networking, and automotive applications.

Kandou is a leading-edge technology company specializing in the development of high-speed, energy-efficient chip-to-chip link solutions. Their innovations address the growing demands for bandwidth and energy efficiency in data centers, enterprise networking, and consumer electronics.

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Kandou