KLA Corporation designs, manufactures, and markets process control, process-enabling, and yield management solutions for the semiconductor and related electronics industries worldwide. It operates through four segments: Semiconductor Process Control; Specialty Semiconductor Process; PCB, Display and Component Inspection; and Other. The company offers integrated circuit (IC) manufacturing products that comprises wafer inspection and review, and metrology; wafer and substrate defect inspection and metrology; reticle defect inspection and metrology; chemical/materials quality analysis; in situ process management and wafer handling diagnostics for IC and original equipment manufacturer (OEM) manufacturing; software products to provide run-time process control, defect excursion identification, process corrections, and defect classification; and refurbished and remanufactured products. It also provides specialty semiconductor manufacturing, benchtop metrology, surface characterization, and electrical property measurement services for general purpose/ lab applications; etch, plasma dicing, deposition, and other wafer processing technologies and solutions for the semiconductor and microelectronics industry. In addition, the company offers direct imaging, inspection, optical shaping, additive printing, and computer-aided manufacturing and engineering solutions for the PCB market; inspection and electrical testing systems to identify and classify defects, as well as systems to repair defects for the display market; and inspection and metrology systems for quality control and yield improvement in advanced and traditional semiconductor packaging markets. The company was formerly known as KLA-Tencor Corporation and changed its name to KLA Corporation in July 2019. KLA Corporation was incorporated in 1975 and is headquartered in Milpitas, California.

KLA Corporation

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KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward.

Visit us at: www.kla.com

Statements made on LinkedIn may constitute forward-looking statements under federal securities laws.  These forward-looking statements involve risks and uncertainties that could significantly affect the expected results and are based on certain key assumptions. Due to such uncertainties and risks, no assurances can be given that such expectations will prove to have been correct, and readers are cautioned not to place undue reliance on such forward-looking statements, which speak only as of the date indicated. Other risks that KLA faces include those detailed in KLA filings with the Securities and Exchange Commission, including KLA's annual report on Form 10-K and quarterly reports on Form 10-Q.  Forward-looking statements made by third parties do not necessarily reflect the opinion of KLA, are outside of KLA’s control and have not been verified or otherwise vetted by KLA. 

2023 was a year of recognition from prestigious organizations, with KLA garnering awards from TIME magazine, Newsweek and, most recently, the Forbes list of World’s Best Employers. Check out our coverage.  

Meet Fengchoa and Terry!

Fengchoa Gong and Terry Wen met at a former employer and became fast friends while bonding over basketball. After Fengchoa joined KLA as a customer service engineer (CSE) in 2020, he realized Terry was a perfect match for the company. KLA is happy to see friends turn into exceptional teammates!

#GreaterTogether #KLACareers

KLA is a sponsor and will exhibit at the IMAPS International Conference & Exhibition on Device Packaging, held from 18 - 21 March, at the WeKoPa Resort and Conference Center, Fountain Hills, AZ.
 
Come and visit us at booth 32 to learn more about our wafer processes and process control solutions for advanced packaging.
 
Don't miss KLA present 'Metrology of Electrodeposition of New Iron-Alloy Barrier Layers in Packaging' at the WP2: Fan-Out, Wafer Level Packaging & Flip Chip Track: Process and Materials session, 4:30pm, 20 March.
 
More info here: https://lnkd.in/eYEB7ERF
 
#AdvancedPackaging #Innovation

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