TXC Corporation engages in the research, design, development, production, and sale of crystal and oscillator products in Taiwan and internationally. The company's products include crystals, oscillators, and sensors, as well as automotive crystals. It also engages in the 5G infrastructure and device ecosystem development activities. The company's products are used in various applications, including mobile communication, information and storage device, internet of things, vehicle electronics, telecommunication equipment, smart home, AI, medical care, 5G, etc. TXC Corporation was incorporated in 1983 and is headquartered in Taipei, Taiwan.

TXC Corporation

Tech-X Corporation provides advanced physics simulation software designed to empower researchers, engineers, and scientists to tackle complex challenges and make well-informed, critical decisions.

Tech-X Corporation

Chemistream

Tech-X Corporation specializes in high-performance computational software. Our work aims to understand physical systems via modern computational methods and advanced visualization.
Tech-X Corporation offers opportunities for scientific and technical professionals with advanced degrees and computational skills to work in an environment where each individual has a stake in the company's development and direction.

🚀 Join Tech-X at IVEC2024 in Monterey! 🚀
Tech-X is thrilled to invite you to the International Vacuum Electronics Conference (IVEC2024), which will be held April 22-25, 2024, in the beautiful city of Monterey, California. We'll connect with industry professionals through a series of dynamic workshops and informative sessions.

📍 Meet Us at Table #20!
Discuss your challenges and needs with our experts. Grab a 30-day evaluation of VSim, our cutting-edge simulation software designed to elevate your research.

🔍 Workshop Details:

Morning Session
Time: 10:40 AM - 12:20 PM
Location: San Carlos 1
Start your day with us for an engaging introduction to Tech-X and VSim. The session will include examples demonstrating the practical applications of VSim in vacuum electronics.

Evening Session
Time: 7:00 PM - 10:00 PM
Location: San Carlos 1

Join our VSim workshop and open forum. This session is designed for both advanced users to delve deeper and newcomers to explore the capabilities of VSim. Engage with our team, share your experiences, and learn from peers.

📊 Presentations to Watch:
VSim Poster: P-6.10 presented by Ming-Chieh Lin, focusing on Integration of the Magnetic Circuits for Magnetrons Using New Magnetostatic Solvers in VSim.
VSim Paper: 6.4 by Ming-Chieh Lin, discussing an Electron Beam Manipulated by Laguerre-Gaussian Modes.

📢 Call for Participation:
We encourage all VSim users attending IVEC to showcase their work at the VSim Forum. It's a fantastic platform for sharing your breakthroughs and contributing to the community's growth.
🍽️ Refreshments will be served at both sessions to ensure a welcoming and engaging environment.
🔗 We can't wait to meet you there and discuss how we can move forward together in the field of vacuum electronics. For more info or to schedule a meeting with our team at 

IVEC2024, email us at sales@txcorp.com.

#IVEC2024 #TechX #VSim #VacuumElectronics #Engineering #Science #TechConference #Networking

🚀 Reflecting on a Remarkable Year at Tech-X Corporation: Happy Holidays! 🌟

As we draw the curtain on 2023, we at Tech-X Corporation, leaders in plasma physics simulation software, want to extend a heartfelt season’s greetings to you, our valued community. 🎄✨

This year has been transformative, filled with challenges turned into opportunities and achievements that were made possible because of your support. Your trust in our expertise and products has been the cornerstone of our success, a reminder that our work transcends technology—it’s about people, connections, and making a difference. 🌍❤️

🌟 2023: A Year of Collective Success

Worldwide Conferences: This year’s global presence was not just about showcasing our innovations but also about building meaningful connections that foster growth and understanding.

Thought Leadership: We’ve endeavored to create not just the best solutions in plasma physics simulations but also to be a catalyst for change and inspiration in our industry.

VSim 12.2 Update: More than a technological advancement, it’s our commitment to answering the evolving needs of the semiconductor manufacturing sector.

Innovative Features & Enhanced Performance: Tailored to empower your work with precision and efficiency, these updates reflect our dedication to your success.

Engaging ICP Examples & Improved Functionality: Demonstrations of our continuous dialogue with you, ensuring that our tools are not only cutting-edge but also user-centric and relevant.

Your feedback and engagement have been valuable, guiding us in our pursuit of excellence and innovation. In every challenge, we’ve seen an opportunity to learn, grow, and adapt, driven by our belief in the power of perseverance and continuous improvement.

🎁 As we step into the New Year, we do so with immense gratitude and renewed commitment to our journey together. Here’s to a future filled with collaboration, breakthroughs, and transformative achievements!

Happy Holidays and a Prosperous New Year!

#TechXCorporation #HappyHolidays #Gratitude #Innovation #PlasmaPhysics #VSim  #simulationsoftware #semiconductormanufacturing

📣 **Exciting Update:** Tech-X Worldwide Simulation Summit 2023 Schedule Released!

Dive into the intricacies of plasma physics simulations over two enlightening days:

**Monday, Oct 16, 2023 🗓️**
- 🔍 9:30 - 10:00: Plasma Physics Research using VSIM with Dr. Lenaic Couedel.
- 🖥️ 10:00 - 10:45: VSimPlasma's Analysis of Inductively Coupled Plasma Power Deposition by Dr. Eve Lanham.
- ⏲️ 10:45 - 11:00: Refresh & Reset.
- 📈 11:00 - 11:30: Improving VSim simulations using the Penning Trap model with Dr. Dan Murray.
- 🔬 11:30 - 12:00: XSim Preview by Professor Dr. John Cary.
- 🍽️ 12:00 - 1:30: Lunch & Networking.

**Tuesday, Oct 17, 2023 🗓️**
- 📊 9:30 - 10:00: The Child Langmuir Illusion with Dr. Dan Faircloth.
- ⚙️ 10:00 - 10:45: Magnetron Sputtering with Joe Theis.
- ⏲️ 10:45 - 11:00: A brief moment to reflect.
- 🧪 11:00 - 11:30: Advanced Wafer techniques by Dr. Daniel Main.
- 🔎 11:30 - 12:00: Modeling ion sources with VSim 12 by Dr. Seth Veitzer.
- 🍽️ 12:00 - 1:30: Lunch.

Engage with industry experts, learn from the best in the field, and explore the future of simulation. Don't miss out!

**Discover more and register now:** 
https://lnkd.in/gynbkeaD

#TechX2023 #PlasmaPhysics #SimulationInnovation #TWSS

Be sure to follow Tech-X's newest product that has opened up for beta-testing!

The ICP solver, energy conserving Particle-In-Cell, and load balancing make this in practice a major version release. Incredible new abilities to model and do so for new physical situations, with greater stability, and more rapidly, in some cases taking enabling previously weeks long calculations to complete in an hour or less.

VSim 12.2 Available For Download August 16th, 2023
This release comes with a significant new feature: A unique implicit EM solver for modeling Inductively Coupled Plasmas. We also have a major improvement, a new analyzer for improved domain decomposition, and several other enhancements.
      
Inductively Coupled Plasma Webinar
August 16th, 2023 at 10 AM MDT

https://lnkd.in/ghNxaCpU

We are pleased to announce a new ability to efficiently simulate Inductively-Coupled Plasmas (ICPs). VSim has long had the capability to simulate full electromagnetic plasma simulations, but these simulations can be prohibitively expensive for modeling both capacitively-coupled plasmas (CCPs) and inductively-coupled plasmas (ICPs). While electrostatic simulations work well for CCPs, where the electric field is normal to the surface, a new implicit solver was needed for ICPs. We are pleased to announce the release of this solver for 2D cartesian and cylindrical plasmas. 

Eve Lanham and John Cary led this development with significant contributions from Jarrod Leddy and Ilya Zilberter. Please join us for our webinar on August 16 to hear about our new example demonstrating this capability.

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