Molded Interconnect System (MIS) provides pre-molded, routable, fine pitch leadframe solutions for complex designs that require a smaller package footprint and thinner package height.

Unisem (M) Berhad manufactures and sells semiconductor devices. It offers an integrated suite of packaging and test services, which include wafer bumping, wafer probing, and wafer grinding; wafer level chip-scale packaging and radio frequency services; a range of leadframe and substrate integrated circuit packages; and analog, digital, and mixed-signal testing services. The company also provides test related services, such as reliability testing, thermal and electrical characterization, dry pack, and tape and reel; and semiconductor assembly and test services to electronics companies. In addition, it provides turnkey services comprising design, assembly, test, failure analysis, warehousing, and drop-ship services. Further, the company offers marketing and other support services. It serves fabless companies and integrated device manufacturers primarily in the United States, Europe, and Asia. The company was incorporated in 1989 and is headquartered in Kuala Lumpur, Malaysia. Unisem (M) Berhad is a subsidiary of Huatian Technology (Malaysia) Sdn. Bhd.

5005

COM:UNISEMGROUP

Molded Interconnect System (MIS) Technology

Last Close

4.05

26/07 08:59

Market Cap

6.95B

Beta: -

Volume Today

2.07M

Avg: -

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