Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and tools used to assemble semiconductor devices. It operates through two segments, Capital Equipment, and Aftermarket Products and Services (APS). The company manufactures and sells advanced displays; die-transfer, flip-chip, and TCB advanced packaging products; ball bonder, die-attach, electronics assembly, lithography, wafer-level bonder, and wedge bonder products; consumables, such as capillaries, dicing blades, and wedge bonds; and auto offline programming, KNet PLUS, and new product introduction/manufacturing execution system software products. It also services, maintains, repairs, and upgrades equipment. The company serves semiconductor device manufacturers, integrated device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, industrial manufacturers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. Kulicke and Soffa Industries, Inc. was founded in 1951 and is headquartered in Singapore.

Kulicke and Soffa Industries, Inc.

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices.

Kulicke & Soffa

ENABLING A SMARTER FUTURE: Ready to discover our latest cutting-edge solutions at SEMICON China? Join us from March 20-22, 2024 at Shanghai New International Expo Center, Booth 3431 (Hall N3) – we’ll see you there! 🦾

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Empowering women everywhere today and every day! Happy International Women's Day from all of us at K&S! 💪✨ #IWD2024 #WomenInTech #Empowerment #oneKS #KStechdiscovery #semiconductor #technology #engineering

We are thrilled to announce that Kulicke & Soffa has been honored with the Best Supplier Award 2023 by SHENZHEN XINHAI MICRO-ELECTRONICS CO.,LTD! 🏆 This recognition reflects K&S's unwavering commitment to ethical standards, outstanding performance in cost, technology, responsiveness, supply assurance, and quality.
 
Big thanks to the dedicated K&S team for their ongoing efforts and contribution that were instrumental in clinching this award!
 
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Kickstart your 2024 with us and dive into the forefront of wire bonding solutions at our first tradeshow of the year, NEPCON JAPAN! ✨

Get ready to be captivated by our featured RAPID™ Pro, a market-leading high-performance ball bonder equipped with Smart Features for Industry 4.0 and Asterion™, an enhanced capability hybrid wedge bonder. Connect and embark on a journey of technological discovery with us at NEPCON JAPAN 2024!

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Happy New Year from our K&S family to yours and may the new year bring joy, growth and countless moments of happiness! 🥳🎉

NASDAQ:KLIC

Kulicke and Soffa Industries, Inc.

Last Close

42.16

25/09 14:39

Market Cap

2.76B

Beta: 1.41

Volume Today

29.09K

Avg: 398.29K

PE Ratio

51.40

PFCF: 48.11

Dividend Yield

1.64%

Payout:62.23%

Financials Not Available