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AMD and Raytheon Collaborate for Military Chip Packaging
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AMD and Raytheon have teamed up to develop advanced chip packaging technology for military applications, leveraging Raytheon's interposer and AMD's expertise in 2.5D and 3D direct bonding technologies. The technology aims to process data from various sensors and is part of a $20 million contract through the S2MARTS consortium.
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How does the partnership between AMD and Raytheon reflect broader trends in the technology industry and its application in defense sectors?
How might this advanced chip packaging technology impact the performance and capabilities of military applications?
What are the potential implications of this collaboration between AMD and Raytheon on the broader technology landscape?
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