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OverviewAPI
The Biden administration launches a $3 billion program to advance semiconductor packaging capabilities, aiming to create multiple high-volume advanced packaging facilities in the US and establish the country as a global leader in commercial-scale advanced packaging for sophisticated chips. The program focuses on investments in materials, substrates, equipment, tools, processes, power delivery, thermal management, photonics, connectors, chip ecosystem, and co-design for improved yield, performance, reliability, and cost in advanced packaging.

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