Amkor Technology is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor’s operational base includes production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the USA.Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly, and final test.  The availability of high-quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions.  Amkor‘s packaging formats include wafer-level, CSP, BGA, leadframe and the enablement of next-generation 3D packaging solutions.  Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO).  3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.

Amkor Technology, Inc.

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Unisem

Amkor Technology is a leading provider of high-quality semiconductor packaging and test services, with a focus on customer service, engineering expertise, and high-volume manufacturing excellence. The company operates production facilities, product development centers, and sales and support offices in key electronics manufacturing regions globally.

Director, MEMS and Sensor Products BU

Deputy Director at Amkor Technology

Sr. Department Manager

Technical Marketing Section Manager

Researcher

MEMS Designer

Chiung Lee

Director, Flip Chip BGA Products Business Unit

Technology Program Managner and Senior Member of Technical Staff

Senior Member of Technical Staff

Research Staff Member

Independent Electrical/Electronic Manufacturing Professional

Rao Bonda

Senior Director Advanced Engineering Services (Global)

Sr. Director Advanced Test

Technical Director - MEMS & Advanced Test Development

Lead Refrence Design Engineer Performance and Test

Senior Member Technical Staff - System Test

Senior Test Engineer

Sr Systems Engineer

Senior Director of Advanced Engineering Services (Global) at Amkor Technology, Inc.

Gerard J.

Human Resources Manager

Franchise Owner

Head,  Human Resources (Sr. Director)

Department Manager (OD and Training)

Section Manager

Senior Officer

Franchise Owner at Banh Mi Kitchen

Nora Manalaysay

Marlow Navigation

Director Customer Integration

Tami Thomas-Kennard

Director, R&D Design Center at Amkor Technology

Sr. Design Manager

Corporate Quality Manager

August Miller

Sr. Director, Product Manager

RND Researcher and Equipment Development for New Processes and New Package

Leading Global Factories Process Improving Council & Equipment Selection

Sr. Director - Amkor Technology

Junyoub Lee

Senior Director – MEMS and Sensor Products

Director – MEMS and Sensor Products

Principal Engineer / Team Leader Technology Development

Manager R&D Excellence

Package Concept Engineer

Senior Consultant at Infineon Technologies AG

Senior Director – MEMS and Sensor Products at Amkor Technology Germany GmbH

Stefan Martens

Director, Recruitment

Manager, Human Resources

Director, Recruitment at Amkor Technology

Paulette Galloway

Sr Director Strategic Accounts bij Amkor Technology, Inc.

Director Strategic Accounts

Customer Service Operation & Supply Chain Manager

Customer Integration Manager

CKA Business & Supply Chain Manager

Management Trainee

Boudewijn Janssen

SENIOR DIRECTOR, HEAD OF IT OPERATIONS, IT DIVISION MANAGER, AND EXECUTIVE STAFF

PROFESSORIAL LECTURER, GRADUATE STUDIES IN BUSINESS

TEST PRODUCT ENGINEERING MANAGER – ASIA FACTORY OPERATIONS

Test Engineering Manager

Head of IT Operations and Executive Staff at Amkor Technology, Inc. | IT Infrastructure, Digital Transformation, Smart Factory, I4.0, Global IT Shared Services, Cybersecurity, Analytics, RPA

Jonathan Mondero

Director, Technical Program Manager

Deputy Director, Technical Program Manager

Senior Technical Program Manager

Senior Project Engineer

Project Engineer

Customer Support Engineer

Director of Sales Technical Program Management | Semiconductors | Global Account Management | Supply Chain Management | MBA | MSc | PMP |

Manoharan Gurusamy

Senior Director, Advanced Product Development Division

Principal Manager, IC Packaging

Packaging Engineer

Ricky Zang

Director - Global Test Services

Global Account Manager

ECT- Regional Sales Manager (West)

Regional Sales Manager

Regional Sales Manager - ECT

ECT - Regional Sales Manager

Senior Sales Engineer

Laser Equipment Engineering Manager

Equipment Manager

Equipment Engineering Manager

R&M Tech III

Claude Castiglione

Director, Technical Sales

Director, Technical sales

Packaging

Director, Technical Sales at Amkor Technology

Faramarz P

Director, FcPOP, FpfcCSP, FcCSP Business Unit

Staff IC Packaging Engineer

Sr. IC Packaging Materials Engineer (ATTD)

Sr. IC Packaging Failure Analysis (FA) Engineer (Quality & Reliability, CQN)

Director, FcPOP, FpfcCSP, FcCSP Business Unit at Amkor Technology, Inc.

Kabir Mirpuri

Senior Director, Corporate Legal - - Singapore

Vice President, TW Compliance Head - - Greater China Team

Vice President, Legal & Compliance - - Hong Kong

Vice President, TW Legal & Compliance Head

Senior Director, Corporate Legal - Singapore

Kevin Hsieh

Director, Package Development

Manager, Package Development

Senior Packaging Engineer, Package Development

Packaging Engineer, IC Substrate Design

Packaging Engineer, IC Substrate Development

IC Packaging / Amkor Technology Inc

Donghee K

Sr Director (수석)

Technologist

부장

Senior SW Engineer

Senior Engineer

R & D staff member

Engineer

Embedded Software Engineer, Audio & Image Signal Processing

Jong Kim

Senior Director, Business Operations

Process Director, Clinical Performance Design

Manager Business Process Management

Customer Quality Engineer

eBusiness Project Manager / Business Analyst

Division Planner

Business Solutions | Process Improvement | Sustainable Results

Juan Gonzalez

Senior Director Technical Programs

Dir of Quality/CS

TPM/Sales

Senior Director Technical Programs at Amkor Technology, Inc.

Rob C

Director Sales & Customer Service

VP Sales and Marketing

Director West Coast Sales

Director  Sales

Walt T

Director, IT Security

Network  and Security  Architect

Staff Engineer

IT Manager

Sr Network systems specialist

Sr Network systems Specialist

Director, IT Security at Amkor Technology, Inc.

Surya Konala

Senior Director Technical Programs U.S. East Region

Senior Program Manager, Board Operations

Director, Packaging Development and Assembly Engineering

Sr. Manufacturing Strategy Manager and Distinguished Member of Technical Staff

Global Procurement, Final Manufacturing Materials Manager

Global Package Engineer/Engineering Manager

Senior Director Technical Programs U.S. East Region at Amkor Technology, Inc.

Trent Thompson

Senior Director  FCBGA/fccsp Product Business Unit

Program Management Post Fab/Turnkey PMTS

Package Applications Engineering Principal Member of Technical Staff

Deputy Director

Director Technical Program Management

Director Flipchip Product Business

Process Engr

Process and Development Engr(Flip Chip BGA and PBGA Mold

FCBGA/fccsp Product Business Unit

Millete Carino

Retired

Director, Technical Program

Project Manager - Power Electronics

Sr. Program Manager

Project Manager, Packaging Solutions - NPI

Project Controller - Cellular Products Group

Business & Project Manager - Product Packaging & Business Services

Cost Manager - Manufacturing

Business Manager- Final Manufacturing Capacity

Product Packaging Engineering Manager

Dan Pizarek

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COM:AMKOR

Amkor Technology

Last Close

26.35

22/11 21:00

Market Cap

6.55B

Beta: -

Volume Today

800.93K

Avg: -