Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory on top of digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

Amkor Technology, Inc.

Amkor Technology is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor’s operational base includes production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the USA.Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly, and final test.  The availability of high-quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions.  Amkor‘s packaging formats include wafer-level, CSP, BGA, leadframe and the enablement of next-generation 3D packaging solutions.  Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO).  3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.

	Dec '14	Dec '15	Dec '16	Dec '17	Dec '18	Dec '19	Dec '20	Dec '21	Dec '22	Dec '23
revenue	3.13B -	2.88B 7.82%	3.89B 34.98%	4.19B 7.52%	4.32B 3.10%	4.05B 6.11%	5.05B 24.62%	6.14B 21.54%	7.09B 15.53%	6.50B 8.30%
cost of revenue	2.58B -	2.41B 6.65%	3.20B 32.96%	3.43B 7.22%	3.61B 5.15%	3.40B 5.62%	4.15B 21.94%	4.91B 18.39%	5.76B 17.28%	5.56B 3.50%
gross profit	552.82M -	479.26M 13.31%	695.48M 45.11%	757.27M 8.89%	710.57M 6.17%	649.44M 8.60%	900.81M 38.71%	1.23B 36.05%	1.33B 8.52%	943.15M 29.09%
selling and marketing expenses		-755K -
general and administrative expenses	254.50M -	232.41M 8.68%	284.33M 22.34%	297.45M 4.62%	295.24M 0.74%
selling general and administrative expenses	254.50M -	231.65M 8.98%	284.33M 22.74%	297.45M 4.62%	295.24M 0.74%	281.93M 4.51%	302.84M 7.42%	296.08M 2.23%	283.37M 4.29%	295.39M 4.24%
research and development expenses	76.86M -	82.02M 6.70%	117.21M 42.90%	166.61M 42.15%	157.18M 5.66%	137.64M 12.43%	140.73M 2.24%	166.04M 17.99%	149.43M 10.00%	177.47M 18.77%
other expenses	24.54M -	-10.93M 144.53%	5.85M 153.57%	-11.89M 303.09%	6.62M 155.66%	-1.77M 126.79%	-6.39M 260.69%	3.14M 149.12%	18.31M 482.90%
cost and expenses	2.91B -	2.72B 6.50%	3.60B 32.39%	3.89B 8.16%	4.06B 4.24%	3.82B 5.80%	4.59B 20.16%	5.37B 17.01%	6.19B 15.25%	6.03B 2.61%
operating expenses	331.36M -	313.67M 5.34%	401.54M 28.01%	464.07M 15.57%	452.42M 2.51%	419.57M 7.26%	443.57M 5.72%	462.12M 4.18%	432.80M 6.34%	472.87M 9.26%
interest expense	109.92M -	86.38M 21.42%	84.64M 2.01%	85.55M 1.08%	78.95M 7.72%	71.59M 9.32%	64.17M 10.36%	51.51M 19.73%	58.56M 13.70%	59M 0.75%
ebitda	710.71M -	648.87M 8.70%	854.98M 31.77%	863.25M 0.97%	836.72M 3.07%	752.27M 10.09%	961.25M 27.78%	1.33B 38.38%	1.53B 14.89%	470.29M 69.23%
operating income	221.46M -	165.59M 25.23%	293.94M 77.51%	293.20M 0.25%	258.14M 11.96%	233.17M 9.67%	457.25M 96.10%	763.43M 66.96%	897.19M 17.52%	470.29M 47.58%
depreciation and amortization	464.71M -	494.20M 6.35%	555.19M 12.34%	581.94M 4.82%	571.96M 1.71%	519.10M 9.24%	504.00M 2.91%	566.72M 12.44%	631.01M 11.34%
total other income expenses net	24.54M -	-10.93M 144.53%	5.85M 153.57%	96.22M 1,543.66%	6.62M 93.12%	-73.36M 1,208.66%	-70.56M 3.81%	-48.37M 31.46%	-40.25M 16.77%	-26.45M 34.30%
income before tax	136.08M -	68.29M 49.82%	215.16M 215.06%	303.87M 41.23%	185.81M 38.85%	159.81M 14.00%	386.68M 141.96%	715.07M 84.92%	856.93M 19.84%	443.84M 48.21%
income tax expense	33.84M -	28.04M 17.17%	47.85M 70.69%	38.98M 18.54%	56.25M 44.30%	37.18M 33.90%	46.18M 24.21%	69.46M 50.40%	89.89M 29.41%	81.71M 9.10%
net income	130.39M -	57.57M 55.85%	164.19M 185.22%	260.71M 58.78%	127.09M 51.25%	120.89M 4.88%	338.14M 179.71%	643.00M 90.16%	765.82M 19.10%	359.81M 53.02%
weighted average shs out	230.71M -	236.85M 2.66%	237.42M 0.24%	238.94M 0.64%	239.33M 0.16%	239.72M 0.17%	241.51M 0.74%	243.88M 0.98%	244.68M 0.33%
weighted average shs out dil	236.73M -	237.17M 0.19%	238.03M 0.36%	239.65M 0.68%	239.74M 0.04%	240.12M 0.16%	242.25M 0.89%	245.70M 1.43%	246.21M 0.20%
eps	0.56 -	0.24 57.14%	0.69 187.50%	1.09 57.97%	0.53 51.38%	0.50 5.66%	1.40 180.00%	2.64 88.57%	3.13 18.56%	1.46 53.35%
epsdiluted	0.55 -	0.24 56.36%	0.69 187.50%	1.09 57.97%	0.53 51.38%	0.50 5.66%	1.40 180.00%	2.62 87.14%	3.11 18.70%	1.46 53.05%

COM:AMKOR

Amkor Technology

Last Close

26.35

22/11 21:00

Market Cap

10.69B

Beta: -

Volume Today

800.93K

Avg: -

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