Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory on top of digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

James Kim

Hyang-Soo Kim

Amkor Technology, Inc.

TAT Technologies Ltd., together with its subsidiaries, provides solutions and services to the commercial and military aerospace, and ground defense industries in the United States, Israel, and internationally. The company operates through four segments: Original Equipment Manufacturing (OEM) of Heat Transfer Solutions and Aviation Accessories; Maintenance, Repair, and Overhaul (MRO) Services for Heat Transfer Components and OEM of Heat Transfer Solutions; MRO Services for Aviation Components; and Overhaul and Coating of Jet Engine Components. It designs, develops, and manufactures a range of heat transfer solutions, such as pre-cooler and oil/fuel hydraulic heat exchangers used in mechanical and electronic systems in commercial, military, and business aircraft; environmental control and power electronics cooling systems for use in aircraft and ground applications; and a range of other mechanical aircraft accessories and systems, such as pumps, valves, and turbine power units. The company also provides MRO services for heat transfer components, as well as for manufacturing heat transfer solutions; and aviation components. In addition, it engages in the operation of a repair station, which provides heat transfer MRO services for airlines, air cargo carriers, maintenance service centers, and the military; and the overhaul and coating of jet engine components, including turbine vanes and blades, fan blades, variable inlet guide vanes, and afterburner flaps. The company was formerly known as Galagraph Ltd. and changed its name to TAT Technologies Ltd. in May 1992. TAT Technologies Ltd. was founded in 1969 and is based in Netanya, Israel.

TAT Technologies Ltd.

Amkor Technology is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor’s operational base includes production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the USA.Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly, and final test.  The availability of high-quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions.  Amkor‘s packaging formats include wafer-level, CSP, BGA, leadframe and the enablement of next-generation 3D packaging solutions.  Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO).  3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.

Metric
Company Name	Amkor Technology, Inc.	TAT Technologies Ltd.
Symbol	AMKR	TATT
MSH ID	COM:AMKOR	COM:TAT-TECHNOLOGIES
Market	STOCKS	STOCKS
Sector	Technology	Industrials
Industry	Semiconductors	Aerospace & Defense
Country	US	IL
Stage	Post-IPO Secondary
Employee Count	28.70K	540
Website	amkor.com	tat-technologies.com
LinkedIn	amkor-technology
Founders

Metric
Market Cap	10.69B	147.56M
Enterprise Value
Monthly Web Traffic	50.47K
Web Traffic Growth	0.25
Valuation
Raised Capital	240M

Metric
Revenue	6.50B	113.79M
Revenue (LTM)
Revenue (NTM)
Gross Profit	943.15M	22.47M
EBITDA	470.29M	10.35M
Operating Income	470.29M	5.64M
Net Income	359.81M	4.67M
EPS	1.46	0.52
Diluted EPS	1.46	0.51
Revenue 2022
Revenue 2023
Revenue 2024
Revenue 2025
Revenue 2026

Metric
Revenue Growth (LTM)
Revenue Growth (NTM)
Gross Profit Growth (LTM)
EBITDA Growth (LTM)
Net Income Growth (LTM)
14-Day Growth Score
28-Day Growth Score
90-Day Growth Score
365-Day Growth Score

Metric
Gross Profit Margin	0.15	0.21
Operating Profit Margin	0.07	0.06
EBITDA Margin	0.07	0.09
Net Profit Margin	0.06	0.05
Return on Equity	0.10	0.08
Return on Assets	0.06	0.05
Return on Capital Employed	0.09	0.07

COM:AMKOR

Amkor Technology

Last Close

26.35

22/11 21:00

Market Cap

10.69B

Beta: -

Volume Today

800.93K

Avg: -

Company Overview

Market Metrics

Financial Performance

Growth Metrics

Profitability Ratios

Valuation Multiples

Operational Metrics

Cash Flow Metrics

Balance Sheet Metrics

Efficiency Metrics

Metric
P/E Ratio	19.48	22.41
P/B Ratio	2.06	1.33
Revenue Multiple (LTM)
Revenue Multiple (NTM)
EBITDA Multiple (LTM)
EBITDA Multiple (NTM)
Price to Sales Ratio	1.67	1.49
EV Multiple	11.11	12.57

Metric
Days Sales Outstanding	77.38	62.30
Days Payables Outstanding	53.39	37.23
Days Inventory Outstanding	25.81	204.95
Operating Cycle	90.98	270.39
Cash Conversion Cycle	43.17	238.70
Asset Turnover	0.97	0.90

Metric
Operating Cash Flow	1.27B	2.25M
Free Cash Flow	520.55M	-3.33M
Cash Flow to Debt	1.06	0.08
Operating Cash Flow/Sales	0.20	0.02
Free Cash Flow Yield	0.05	-0.02

Metric
Cash & Equivalents	1.12B	16.64M
Accounts Receivable	205.49M	-4.21M
Inventory	393.13M	51.28M
Goodwill	20.00M
Debt to Capitalization	0.25	0.24
Debt to Assets	0.18	0.23
Current Ratio	1.95	2.29
Quick Ratio	2.08	1.11

Metric
Rule of 40 (LTM)
Rule of 40 (NTM)
Stock Comp to Revenue	0.00	0.00
R&D to Revenue	0.03	0.01
SG&A to Revenue		0.10